Category: Electronic engineering, electronics, mechanical engineering, material engineering
Market survey: II quarter 2019
Announcement:
Supply of approximately 800 high-quality, radiation-tolerant 3D silicon pixel sensors for the Phase-2 upgrade of the CMS Inner Tracker.
CERN intends to place a contract for the supply of approximately 800 single-sided 3D silicon pixel sensors fabricated on high resistivity p-type substrate, for the Phase-2 upgrade of the CMS Inner Tracker. The supply shall be delivered in the period between October 2021 and August 2023. Main features include: -Active thickness: 150 microns (um); -Maximum physical thickness: 270um; -Pixel cell size: either 50um x 50um or 25um x 100um; -Bump-bonding pattern: 50um x 50um; -Sensors array: 864 x 336 pixel cells; -Sensor size: ~44.35mm x 17.70mm. Sensors shall remain highly efficient and dissipate low power after irradiation to fluences of approximately 2e16 Neq/cm2. Breakdown voltage before irradiation shall exceed the full depletion voltage by at least 20V.
Interested firms shall have proven competence and experience in 3D silicon pixel fabrication.
Market Survey scheduled for dispatch: Second quarter 2019
Invitation to Tender scheduled to dispatch: First quarter 2021
Contacts and Interest in being contacted:
To express an interest please send an e-mail to procurement.service@cern.ch
Technically: G. Gomez Gervasio.Gomez@cern.ch
Commercially: C. Carayon charles.carayon@cern.ch
